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11	FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM WAFER LEVEL MEMS PACKAGING 3D wafer level system integration is one sealed by bonding of a cap wafer onto Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2013-01-18 04:24:22 Technology Electronics manufacturing Chemical bonding Wafer bonding Microelectromechanical systems Deep reactive-ion etching Wafer Through-silicon via EV Group Semiconductor device fabrication Materials science Microtechnology
12	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden All Silicon System Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-05 17:47:15 Technology Three-dimensional integrated circuit Wafer Through-silicon via Fraunhofer Society Fraunhofer Group for Microelectronics Integrated circuit Flip chip Semiconductor device fabrication Electronics Microtechnology
13	Components, Packaging, and Manufacturing Technology Society Newsletter THE GLOBAL SOCIETY FOR MICROELECTRONICS SYSTEMS PACKAGING cpmt.ieee.org Add to Reading List Source URL: cpmt.ieee.org Language: English - Date: 2013-01-14 11:33:21 Technology Electronics International nongovernmental organizations Professional associations Standards organizations Three-dimensional integrated circuit Institute of Electrical and Electronics Engineers Through-silicon via Prognostics Integrated circuits Semiconductor device fabrication Electronic engineering
14	White Paper Test Automation of 3D Integrated Systems January 2012 Add to Reading List Source URL: www.synopsys.com Language: English - Date: 2014-11-07 12:41:47 Integrated circuits Semiconductor device fabrication Through-silicon via Software testing Electronic design Automatic test pattern generation Boundary scan Automatic test equipment Synopsys Electronic engineering Electronics Technology
15	Amkor’s Next Generation Packaging Solutions … the future is now! Paul Silvestri I Director, TSV Product Development Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-10-23 00:19:08 Semiconductor device fabrication Microtechnology SDRAM Field-programmable gate array Xilinx 3DS Interposer Through-silicon via Three-dimensional integrated circuit Electronic engineering Integrated circuits Electronics
16	Low-Cost 3D Chip Stacking with ThruChip Wireless Connections [removed] [removed] [removed] Add to Reading List Source URL: www.hotchips.org Language: English - Date: 2014-08-04 13:35:25 Electronic engineering Dynamic random-access memory Wafer backgrinding ANT Wafer Three-dimensional integrated circuit Through-silicon via Semiconductor device fabrication Technology Electronics
17	Business Models to Support Supply Chain Readiness for Mainstream 2.5D & 3D Technologies Presented by Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:42:11 Electronic engineering Three-dimensional integrated circuit Chip scale package Wafer dicing Wafer Microelectromechanical systems Interposer EV Group Through-silicon via Semiconductor device fabrication Electronics Microtechnology
18	Xilinx SSI Technology Concept to Silicon Development Overview Shankar Lakka Aug 27th, 2012 Add to Reading List Source URL: www.hotchips.org Language: English - Date: 2013-07-28 00:30:14 Fabless semiconductor companies Reconfigurable computing Xilinx Field-programmable gate array Semiconductor device fabrication Through-silicon via Interposer Electronic engineering Integrated circuits Electronics
19	The Challenge of Moore’s Law for Fabless Semiconductor Companies Add to Reading List Source URL: www.hotchips.org Language: English - Date: 2013-07-28 00:29:38 Electronics Semiconductor device fabrication Field-programmable gate array Xilinx Through-silicon via Interposer System on a chip Advanced Micro Devices Electronic engineering Integrated circuits Fabless semiconductor companies
20	FRAUNHOFER-INSTITUT FÜR ZUVERLÄSSIGKEIT UND MIKROINTEGRATION J OIN THE T EAM ! Job opportunities @ Fraunhofer IZM-ASSID in Dresden/Moritzburg WHO WE ARE: Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-08 14:28:22 Materials science Fraunhofer Society Wafer bonding Through-silicon via Wafer Deep reactive-ion etching Semiconductor device fabrication Microtechnology Electronics

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